Series Resistance from Die to Package Solution

STEP 0: Pre-Calculation Summary
Formula Used
Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air
Θjp = Θj-Θpa
This formula uses 3 Variables
Variables Used
Series Resistance from Die to Package - (Measured in Kelvin per Watt) - Series Resistance from Die to Package is defined as the resistance experienced from die to the package.
Thermal Resistance between junction and Ambient - (Measured in Kelvin per Watt) - Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction.
Series Resistance from Package to Air - (Measured in Kelvin per Watt) - Series Resistance from Package to Air is defined as the resistance experienced from package to the air.
STEP 1: Convert Input(s) to Base Unit
Thermal Resistance between junction and Ambient: 3.01 Kelvin per Milliwatt --> 3010 Kelvin per Watt (Check conversion ​here)
Series Resistance from Package to Air: 1.41 Kelvin per Milliwatt --> 1410 Kelvin per Watt (Check conversion ​here)
STEP 2: Evaluate Formula
Substituting Input Values in Formula
Θjp = Θjpa --> 3010-1410
Evaluating ... ...
Θjp = 1600
STEP 3: Convert Result to Output's Unit
1600 Kelvin per Watt -->1.6 Kelvin per Milliwatt (Check conversion ​here)
FINAL ANSWER
1.6 Kelvin per Milliwatt <-- Series Resistance from Die to Package
(Calculation completed in 00.004 seconds)

Credits

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Created by Shobhit Dimri
Bipin Tripathi Kumaon Institute of Technology (BTKIT), Dwarahat
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Series Resistance from Die to Package Formula

​LaTeX ​Go
Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air
Θjp = Θj-Θpa

What is heat dissipation in packaging?

The heat generated by a chip flows from the transistor junctions where it is generate through the substrate and package. It can be spread across a heat sink, and then carried away through the air by means of convection. Just as current flow is determined by voltage difference and electrical resistance, the heat flow is determined by temperature difference and thermal resistance.

How to Calculate Series Resistance from Die to Package?

Series Resistance from Die to Package calculator uses Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air to calculate the Series Resistance from Die to Package, The series resistance from die to package formula is defined as resistance experienced from die to package. Series Resistance from Die to Package is denoted by Θjp symbol.

How to calculate Series Resistance from Die to Package using this online calculator? To use this online calculator for Series Resistance from Die to Package, enter Thermal Resistance between junction and Ambient j) & Series Resistance from Package to Air pa) and hit the calculate button. Here is how the Series Resistance from Die to Package calculation can be explained with given input values -> 0.0016 = 3010-1410.

FAQ

What is Series Resistance from Die to Package?
The series resistance from die to package formula is defined as resistance experienced from die to package and is represented as Θjp = Θjpa or Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air. Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction & Series Resistance from Package to Air is defined as the resistance experienced from package to the air.
How to calculate Series Resistance from Die to Package?
The series resistance from die to package formula is defined as resistance experienced from die to package is calculated using Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air. To calculate Series Resistance from Die to Package, you need Thermal Resistance between junction and Ambient j) & Series Resistance from Package to Air pa). With our tool, you need to enter the respective value for Thermal Resistance between junction and Ambient & Series Resistance from Package to Air and hit the calculate button. You can also select the units (if any) for Input(s) and the Output as well.
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