Series Resistance from Die to Package Calculator

✖Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction.ⓘ Thermal Resistance between junction and Ambient [Θ_j]			+10% -10%
✖Series Resistance from Package to Air is defined as the resistance experienced from package to the air.ⓘ Series Resistance from Package to Air [Θ_pa]			+10% -10%

✖Series Resistance from Die to Package is defined as the resistance experienced from die to the package.ⓘ Series Resistance from Die to Package [Θ_jp]

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Formula

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Series Resistance from Die to Package

Formula

Θ jp = Θ j - Θ pa

Example

1.6 K/mW = 3.01 K/mW - 1.41 K/mW

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Series Resistance from Die to Package Solution

STEP 0: Pre-Calculation Summary

Formula Used

Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air
Θ_jp = Θ_j-Θ_pa
This formula uses 3 Variables

Variables Used

Series Resistance from Die to Package - (Measured in Kelvin per Watt) - Series Resistance from Die to Package is defined as the resistance experienced from die to the package.
Thermal Resistance between junction and Ambient - (Measured in Kelvin per Watt) - Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction.
Series Resistance from Package to Air - (Measured in Kelvin per Watt) - Series Resistance from Package to Air is defined as the resistance experienced from package to the air.

STEP 1: Convert Input(s) to Base Unit

Thermal Resistance between junction and Ambient: 3.01 Kelvin per Milliwatt --> 3010 Kelvin per Watt (Check conversion here)
Series Resistance from Package to Air: 1.41 Kelvin per Milliwatt --> 1410 Kelvin per Watt (Check conversion here)

STEP 2: Evaluate Formula

Substituting Input Values in Formula

Θ_jp = Θ_j-Θ_pa --> 3010-1410

Evaluating ... ...

Θ_jp = 1600

STEP 3: Convert Result to Output's Unit

1600 Kelvin per Watt -->1.6 Kelvin per Milliwatt (Check conversion here)

FINAL ANSWER

1.6 Kelvin per Milliwatt <-- Series Resistance from Die to Package

(Calculation completed in 00.004 seconds)

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Created by Shobhit Dimri

Bipin Tripathi Kumaon Institute of Technology (BTKIT), Dwarahat

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Vishwakarma Government Engineering College (VGEC), Ahmedabad

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Series Resistance from Die to Package Formula

Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air
Θ_jp = Θ_j-Θ_pa

What is heat dissipation in packaging?

The heat generated by a chip flows from the transistor junctions where it is generate through the substrate and package. It can be spread across a heat sink, and then carried away through the air by means of convection. Just as current flow is determined by voltage difference and electrical resistance, the heat flow is determined by temperature difference and thermal resistance.

How to Calculate Series Resistance from Die to Package?

Series Resistance from Die to Package calculator uses Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air to calculate the Series Resistance from Die to Package, The series resistance from die to package formula is defined as resistance experienced from die to package. Series Resistance from Die to Package is denoted by Θ_jp symbol.

How to calculate Series Resistance from Die to Package using this online calculator? To use this online calculator for Series Resistance from Die to Package, enter Thermal Resistance between junction and Ambient (Θ_j) & Series Resistance from Package to Air (Θ_pa) and hit the calculate button. Here is how the Series Resistance from Die to Package calculation can be explained with given input values -> 0.0016 = 3010-1410.

FAQ

What is Series Resistance from Die to Package?

The series resistance from die to package formula is defined as resistance experienced from die to package and is represented as Θ_jp = Θ_j-Θ_pa or Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air. Thermal Resistance between junction and Ambient is defined as the rise in the resistance due to the heating effect in junction & Series Resistance from Package to Air is defined as the resistance experienced from package to the air.

How to calculate Series Resistance from Die to Package?

The series resistance from die to package formula is defined as resistance experienced from die to package is calculated using Series Resistance from Die to Package = Thermal Resistance between junction and Ambient-Series Resistance from Package to Air. To calculate Series Resistance from Die to Package, you need Thermal Resistance between junction and Ambient (Θ_j) & Series Resistance from Package to Air (Θ_pa). With our tool, you need to enter the respective value for Thermal Resistance between junction and Ambient & Series Resistance from Package to Air and hit the calculate button. You can also select the units (if any) for Input(s) and the Output as well.

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